Imishini ye-Microhole
Imbobo Eyizimbotshana Entweni Ehlanganisiwe
Ubukhulu bosayizi wokucubungula wesiteshi esikabili: φ450*400mm
Ukunemba kokucubungula: ±0.05mm
Isilinganiso esiphezulu sobubanzi bobubanzi: 20:1
Ngaphambili kwe-Porous Hole
Ubukhulu bosayizi wokucubungula wesiteshi esikabili: φ450*400mm
Ukunemba kokucubungula: ±0.05mm
Isilinganiso esiphezulu sobubanzi bobubanzi: 20:1
I-Cross-Section ye-Porous Hole ku-Coated Material
Ubukhulu bosayizi wokucubungula wesiteshi esikabili: φ200*260mm
Ukunemba kwe-Hole-groove: ±0.03mm
Isilinganiso esiphezulu sobubanzi bobubanzi: 15:1
Ukuqina: ≤Ra3.2
Imbobo emise okwehlengethwa
Usayizi omkhulu wokucubungula: φ200*220
Ukunemba kokucubungula: ±0.03mm
Isilinganiso esiphezulu sobubanzi bobubanzi: 15:1
Ukuqina: ≤Ra3.2
Imbobo emise okwedada
Usayizi omkhulu wokucubungula: φ200*220
Ukunemba kokucubungula: ±0.03mm
Isilinganiso esiphezulu sobubanzi bobubanzi: 15:1
Ukuqina: ≤Ra3.2
I-High-Speed Microhole Machining
Ukusebenza Kakhulu Kwezimbobo Ezimise Okukhethekile kumaSuperalloys
Ubukhulu bosayizi womshini: ≤ф1000*600mm
Isendlalelo esincibilikisiwe: ≤0.03mm
Ukunemba kobubanzi bembobo: ≤±0.02mm
Isivinini sokusika: ≥200mm/min
I-Massive Group Hole Machining Yezimbobo Ezimise Okukhethekile Emagunjini Avuthayo Ahlanganisiwe
Ubukhulu bosayizi womshini: ≤ф1000*600mm
Ukunemba kokwenza izimbobo: ±0.03mm
Linganisa kabusha isendlalelo: ≤0.05mm
Isikhathi somshini womgodi owodwa: ≤15s
I-Group Hole Machining ye-Coated Ceramic Matrix Composite Combustion Chambers
Ukunemba komshini: ±0.03mm
Imicu ye-Ceramic: akukho ukuphuka, akukho oxidation, akukho ukukhishwa kwamanzi
I-Laser Etching Machining
I-Laser Texturing ye-Metal Material Surfaces
Ukucutshungulwa kwe-laser ezindaweni ezingaphezulu kwe-superalloy, ezinobunzima obukhulu obufika ezingxenyeni ezinezindonga eziqinile ze-Ra15: akukho ukuguquguquka, akukho oxidation, akukho ungqimba oluncibilikisiwe.
I-Laser Texturing ye-Composite Material Surfaces
Ukucubungula nge-laser ezindaweni eziyinhlanganisela ezilukiwe
Ukuveza ungqimba lwefiber yengilazi
Akukho monakalo ku-substrate yengilazi
Akukho ukwenza mnyama noma i-carbonization ye-substrate
Ukusikwa Kwamakhava Okuvikela Insimbi Ye-Hemispherical
Ubukhulu bensimbi: 0.3mm, 0.1mm
Usayizi wengxenye: φ300mm
Ukuphakama: 180mm
Ubukhulu bomuntu ngamunye: 1.18mm
Ukunemba kokucubungula: ±0.01mm
Ubuncane bosayizi wokucubungula: 0.1mm
Awekho ama-burrs noma i-carbonization ngemuva kokusika
Ukufakwa kwama-Friction Rings
Ukujula kwe-Etching: 5±1μm
Ukunemba kokucubungula: ±0.01mm
Ukunemba kokujula: ±0.005μm
Akukho imihuzuko, i-oxidation, ama-burrs, noma isendlalelo esincibilikisiwe endaweni engaphezulu
I-Microstructure Scribing ye-Special Coatings
5-axis yokuxhuma (X, Y, Z, Gx, Gy) ububanzi bomugqa wokucubungula we-laser: ≤0.02mm
Ukucubungula ukujula: ≤0.01mm
Isikhala somugqa: 0.2±0.005mm
Imigqa ecutshunguliwe iyafana, ayinakho ukugoba okusobala noma ukuba mnyama
Ukufakwa kwe-Resonant Microstructures(1)
I-Multi-layer metal coating + i-substrate eyinhlanganisela, umonakalo we-substrate ngemva kokunamathisela: ≤30μm
Ukunemba kokucubungula: ±0.01mm
Ubuncane bosayizi wokucubungula: 0.1mm
Akukho ukuxebuka kwe-coating ngemuva kokucwiliswa, akukho mnyama noma i-carbonization ye-substrate
Ukufakwa kwe-Resonant Microstructures(2)
I-70μm i-copper coating + i-glass fibre composite, akukho ukunamathela kwethusi okusele ngemuva kokufakwa, ukulimala kwe-substrate: ≤30μm
Ukunemba kokucubungula: ±0.01mm
Ubuncane bosayizi wokucubungula: 0.1mm
Akukho ukwenza mnyama noma i-carbonization ye-substrate
Ukufakwa kwe-Resonant Microstructures(3)
3μm aluminium enamathela + ingilazi fibre composite, aluminium enamathela kuqoshwe,
umonakalo we-substrate: ≤5μm
Ukunemba kokucubungula: ±0.01mm
Ubuncane bosayizi wokucubungula: 0.1mm
Azikho izinhlayiya ezisele ze-aluminium, azikho i-carbonization yemicu yengilazi
Ukufakwa kwe-Resonant Microstructures(4)
Ukunemba kokucubungula: ±0.01mm
Ubuncane bosayizi wokucubungula: 0.1mm
I-Metal coating + i-substrate eyinhlanganisela, i-metal coating endaweni eqoshiwe, impahla eyinhlanganisela ayinawo umonakalo, akukho mnyama, futhi akukho carbonization
Ultra-Precision Microhole Machining
I-Spherical Filter Mesh Drilling
Ubuningi Bomgodi: Izimbobo ezingama-600
Ububanzi Bomgodi: Ø0.1mm
Ukunemba: ±0.01mm
I-Drilling Direction: Okujwayelekile kuya phezulu
I-Tapered Filter Mesh Drilling (1)
Ubuningi Bomgodi: Izimbobo eziyi-10,200
Ububanzi bembobo: Ø0.05mm
Ukunemba: ±0.02mm
I-Tapered Filter Mesh Drilling (2)
Ubuningi Bomgodi: Izimbobo ezingama-600
Ububanzi Bomgodi: Ø0.1mm
Ukunemba: ±0.01mm
I-Drilling Direction: Okujwayelekile kuya phezulu
I-Laser Cutting Processing
Ukusika Ithebhu Yesixhumi
Isikhathi sokusika sethebhu eyodwa (0.2mm ugqinsi lwe-Cu/Sn-Cr): 0.12s umugqa wokukhiqiza osezingeni eliphezulu wokuhlangana nokusebenza kahle okuphezulu kwe-CT: I-Carbon-free, izinga lokuvuthwa kwe-OS ye-Burr-free: >99% Ukuhlolwa kwe-SI okuphasile: Akukho zinkinga
I-DPC Circuit Board Cutting
Isivinini sokusika seBhodi elingu-0.5mm-thick: 20mm/s
Isivinini sokusika seBhodi elingu-1.0mm-thick: 5mm/s
Ukunemba kobukhulu: ±20μm
Isivinini Sokubhala Sikahafu: 200mm/s
Ikhamera Yezimoto I-Low-Temperature Welding
Ububanzi be-Weld: 0.7mm
Ukujula Kokungena: 0.4mm
Isivinini sokushisela: 10mm/s
Izinga lokushisa lokushisela: Ukubukeka: Indawo Ebushelelezi, Ayina-oxidation, Ayina-Spatter
I-PCB I-Carbon-Free Cutting
Isivinini sokusika se-PCB engu-2mm-thick: 25mm/s
Ukunemba: ±20μm
Indawo Ethinteke Ukushisa: Ikhwalithi yoMphetho: Ayinakhabhoni
I-PCB QR Code Laser Marking
I-QR Code Grade: A-leveli
Ikhwalithi ye-Laser Spot: Iyunifomu & Round
Ukumaka Ukucaca: Ukwakheka Okubukhali
Ukunemba kobukhulu: ±0.05mm
I-MiniLED Backplane Backplane-Free Cutting
Isivinini sokusika sendiza yangemuva engu-1.6mm enogqinsi: 25mm/s
Ukunemba: ±20μm
Indawo Ethinteke Ukushisa: Ikhwalithi yoMphetho: Ayinakhabhoni
Inspection Equipment Machining
Ukuhlolwa Kwemigodi Emise Okukhethekile
Ukubekezelela isikhundla: Φ0.04mm (±0.02mm)
Ukubekezelela I-Angular: ±0.1°