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Light Laser PCB Separator.jpg

UV/Green Light Laser PCB Separator

This equipment is mainly used for precision cutting of materials such as FPC, PCB, aluminum foil, and copper foil. Equipped with UV/green light lasers, it achieves cutting without taper, no residue on edges, smooth cross-sections, and almost no cracks on cutting edges. Through fine laser focusing technology, an extremely small light spot (focus spot diameter less than 20μm) is obtained, enabling ultra-precision processing.

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    product details

    Features

    ●Optimizes speed and effect under the same power; meanwhile, performs efficient dust-proof treatment to effectively extend the equipment's shutdown period for cleaning and maintenance;
    ●Enables in-line cutting and unmanned operation, saving labor costs;
    ●No consumables or tool wear during processing;
    ●No taper or residue on edges, smooth cross-sections, almost no cracks on cutting edges; ultra-precision processing is achieved through fine laser focusing technology with a small light spot (focus spot diameter less than 20μm);
    ●Equipped with auxiliary machine vision and automatic calibration, featuring high-precision image recognition and positioning functions for convenient and fast operation;
    ●Laser action point has concentrated energy and high peak power, ensuring high cutting efficiency and capable of cutting various PCB boards with complex shapes.

    Specifications

    Parameter

    Specification

    Processing Range

    350mm*350mm

    Scanning Range of Galvanometer

    40mm×40mm

    Scanning Speed

    ≤5000mm/s

    X, Y Positioning Accuracy

    ±3um

    X, Y Repeat Positioning Accuracy

    ±2um

    Platform Moving Speed

    ≤1000mm/s

    CCD Positioning Accuracy

    ±3um @5 - million pixels

    Minimum Cutting Line Width

    <20um

    Maximum Cutting Thickness

    1.0mm

    Comprehensive Cutting Accuracy

    ±30um

    Equipment Overall Dimensions

    1000mm*1200mm*1520mm (excluding three - color light)

    Equipment Weight

    1200kg

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