Thick Glass Laser Processing Equipment
Features
●Adopts a marble precision platform for stable loading and corrosion resistance;
●Integrates a high-precision 3D scanning head, combined with a high-precision linear motor platform, achieving faster speed and better quality than traditional laser processing equipment;
●Standard configuration with a narrow pulse width (<10ns) laser, featuring good beam quality and high processing efficiency;
●Processing size range: ø0.2mm - ø50mm, glass thickness: 0.1mm - 8mm;
●Chipping size ≤120μm;
●Can be equipped with an automatic blanking mechanism and form a closed loop with the measurement system to replace manual work in sorting and packaging OK/NG materials.
Applicable Industries
Applied to precision drilling, special-shaped cutting, and micro-hole processing of solar glass, mobile phone glass, display glass, optoelectronic glass, automotive glass, home appliance and kitchen glass, quartz glass, coated glass, ultra-thin glass, etc.
Specifications
|
Parameter |
Specification |
|
Laser |
Green Light |
|
Rated Output Power of Laser |
8W - 30W (Optional) |
|
Processable Glass Thickness |
0.1 - 8mm |
|
Single Scanning Range |
50mm×50mm |
|
Minimum Processable Aperture |
Φ0.2mm |
|
Chipping |
≤120um |
|
Platform Positioning Accuracy |
±3um |
|
Platform Repeat Positioning Accuracy |
±1.5um |
|
Platform Movement Range |
500mm*550mm (Customizable) |
|
Minimum Cutting Line Width |
<15um |
|
Cutting Dimension Accuracy |
≤±15um |
|
Equipment Dimensions |
1500mm*1300mm*1750mm |
|
Equipment Weight |
1600kg |

