Leave Your Message
*Name Cannot be empty!
Enter a Warming that does not meet the criteria!
* Enter product details such as size, color,materials etc. and other specific requirements to receive an accurate quote. Cannot be empty

Thick Glass Laser Processing Equipment

This equipment uses high-frequency and high-power lasers to cut and drill glass materials. Equipped with high-definition image alignment and a professionally customized operation software control system, it achieves higher production efficiency, more precise repeat positioning, and simpler operation. Currently, the equipment has been widely applied in industries such as instrument glass, photovoltaic glass, medical instruments, vehicle-mounted displays, optoelectronic displays, panel displays, and furniture glass.

    Features

    ●Adopts a marble precision platform for stable loading and corrosion resistance;
    ●Integrates a high-precision 3D scanning head, combined with a high-precision linear motor platform, achieving faster speed and better quality than traditional laser processing equipment;
    ●Standard configuration with a narrow pulse width (<10ns) laser, featuring good beam quality and high processing efficiency;
    ●Processing size range: ø0.2mm - ø50mm, glass thickness: 0.1mm - 8mm;
    ●Chipping size ≤120μm;
    ●Can be equipped with an automatic blanking mechanism and form a closed loop with the measurement system to replace manual work in sorting and packaging OK/NG materials.

    Applicable Industries

    Applied to precision drilling, special-shaped cutting, and micro-hole processing of solar glass, mobile phone glass, display glass, optoelectronic glass, automotive glass, home appliance and kitchen glass, quartz glass, coated glass, ultra-thin glass, etc.

    Specifications

    Parameter

    Specification

    Laser

    Green Light

    Rated Output Power of Laser

    8W - 30W (Optional)

    Processable Glass Thickness

    0.1 - 8mm

    Single Scanning Range

    50mm×50mm

    Minimum Processable Aperture

    Φ0.2mm

    Chipping

    ≤120um

    Platform Positioning Accuracy

    ±3um

    Platform Repeat Positioning Accuracy

    ±1.5um

    Platform Movement Range

    500mm*550mm (Customizable)

    Minimum Cutting Line Width

    <15um

    Cutting Dimension Accuracy

    ≤±15um

    Equipment Dimensions

    1500mm*1300mm*1750mm

    Equipment Weight

    1600kg

    Leave Your Message