Makina a Microhole
Bowo la Porous mu Zida Zokutidwa
Kukula kokwanira kwapawiri-station: φ450*400mm
Processing kulondola: ± 0.05mm
Kuzama kwakukulu kwa m'mimba mwake: 20:1
Mbali Yakutsogolo ya Porous Hole
Kukula kokwanira kwapawiri-station: φ450*400mm
Processing kulondola: ± 0.05mm
Kuzama kwakukulu kwa m'mimba mwake: 20:1
Gawo Lonse la Porous Hole mu Zinthu Zopaka
Kukula kokwanira kwapawiri-station: φ200*260mm
Kulondola kwa dzenje: ± 0.03mm
Kuzama kwakukulu kwa m'mimba mwake: 15:1
Kukula: ≤Ra3.2
Khola looneka ngati Dolphin
Kukula kwakukulu kokwanira: φ200*220
Processing kulondola: ± 0.03mm
Kuzama kwakukulu kwa m'mimba mwake: 15:1
Kukula: ≤Ra3.2
Khola Looneka ngati Swan
Kukula kwakukulu kokwanira: φ200*220
Processing kulondola: ± 0.03mm
Kuzama kwakukulu kwa m'mimba mwake: 15:1
Kukula: ≤Ra3.2
High-Speed Microhole Machining
Kuchita Bwino Kwambiri kwa Mabowo Owoneka Mwapadera mu Superalloys
Kukula kwakukulu kwa makina: ≤ф1000 * 600mm
Wosanjikiza wosungunuka: ≤0.03mm
dzenje m'mimba mwake molondola: ≤± 0.02mm
Kudula liwiro: ≥200mm/mphindi
Mabowo Amagulu Akuluakulu Opangira Mabowo Owoneka Mwapadera Muzipinda Zoyaka Zoyaka
Kukula kwakukulu kwa makina: ≤ф1000 * 600mm
Kupanga mabowo kulondola: ± 0.03mm
Recast wosanjikiza: ≤0.05mm
Nthawi yopangira dzenje limodzi: ≤15s
Gulu la Hole Machining for Coated Ceramic Matrix Composite Combustion Chambers
Kulondola kwa Machining: ± 0.03mm
Ulusi wa Ceramic: palibe kuthyoka, palibe makutidwe ndi okosijeni, palibe kutulutsa pamwamba
Laser Etching Machining
Laser Texturing of Metal Material Surfaces
Kukonzekera kwa laser pamtunda wa superalloy, wokhala ndi nkhanza kwambiri mpaka magawo a Ra15 Thin-mipanda: palibe deformation, palibe oxidation, palibe wosanjikiza.
Laser Texturing of Composite Material Surfaces
Kukonzekera kwa laser pa malo opangidwa ndi nsalu
Kuwulula galasi CHIKWANGWANI wosanjikiza
Palibe kuwonongeka kwa gawo lapansi lagalasi
Palibe mdima kapena carbonization wa gawo lapansi
Kudula kwa Hemispherical Metal Shielding Covers
Kukula kwachitsulo: 0.3mm, 0.1mm
Kukula kwagawo: φ300mm
Kutalika: 180mm
Munthu kukula: 1.18mm
Processing kulondola: ± 0.01mm
Osachepera kukula processing: 0.1mm
Palibe burrs kapena carbonization pambuyo kudula
Kujambula kwa Friction Rings
Kuzama kwakuya: 5±1μm
Processing kulondola: ± 0.01mm
Kulondola kwakuya: ± 0.005μm
Palibe zokopa, makutidwe ndi okosijeni, ma burrs, kapena wosanjikiza wosungunuka pagawolo
Kulemba kwa Microstructure kwa Zovala Zapadera
5-olamulira kulumikizana (X, Y, Z, Gx, Gy) laser processing mzere m'lifupi: ≤0.02mm
Processing kuya: ≤0.01mm
Kutalikirana kwa mizere: 0.2±0.005mm
Mizere yokonzedwa ndi yofanana, yopanda kupindika koonekera bwino kapena kuda
Kuyika kwa Resonant Microstructures (1)
Mipikisano wosanjikiza zitsulo ≤30μm ≤30μm
Processing kulondola: ± 0.01mm
Osachepera kukula processing: 0.1mm
Palibe peeling wa zokutira pambuyo etching, palibe blackening kapena carbonization wa gawo lapansi
Kuyika kwa Resonant Microstructures(2)
70μm zokutira zamkuwa + zophatikizika zamagalasi, palibe zokutira zamkuwa zotsalira pambuyo pokhazikika, kuwonongeka kwa gawo lapansi: ≤30μm
Processing kulondola: ± 0.01mm
Osachepera kukula processing: 0.1mm
Palibe mdima kapena carbonization wa gawo lapansi
Kuyika kwa Resonant Microstructures(3)
3μm zokutira zotayidwa + magalasi opangidwa ndi fiber fiber, zokutira zotayidwa,
Kuwonongeka kwa gawo lapansi: ≤5μm
Processing kulondola: ± 0.01mm
Osachepera kukula processing: 0.1mm
Palibe zotsalira za aluminiyamu particles, palibe carbonization wa galasi ulusi
Kuyika kwa Resonant Microstructures(4)
Processing kulondola: ± 0.01mm
Osachepera kukula processing: 0.1mm
Kupaka zitsulo + gawo lapansi lophatikizika, zokutira zitsulo pamtunda wokhazikika, zinthu zamagulu sizimawonongeka, sizikuda, komanso palibe carbonization
Ultra-Precision Microhole Machining
Spherical Sefa Mesh Drilling
Kuchuluka kwa Bowo: 600 mabowo
Dzenje Diameter: Ø0.1mm
Kulondola: ± 0.01mm
Pobowola: Yachibadwa mpaka pamwamba
Kubowola kwa Mesh Seltered Tapered (1)
Kuchuluka kwa dzenje: 10,200 mabowo
Dyenje awiri: Ø0.05mm
Kulondola: ± 0.02mm
Kubowola kwa Mesh Seltered Tapered (2)
Kuchuluka kwa Bowo: 600 mabowo
Dzenje Diameter: Ø0.1mm
Kulondola: ± 0.01mm
Pobowola: Yachibadwa mpaka pamwamba
Laser Cutting Processing
Cholumikizira Tab Kudula
Nthawi yodula tabu imodzi (0.2mm wandiweyani Cu/Sn-Cr plating): 0.12s Kukumana kothandiza kwambiri mzere wopanga CT: Wopanda Carbon, Burr-free OS zokolola:> 99% kuwunika kwa SI kwadutsa: Palibe cholakwika
DPC Circuit Board Cutting
Kudula Liwiro kwa 0.5mm wandiweyani Board: 20mm/s
Kudula Liwiro kwa 1.0mm wandiweyani Board: 5mm/s
Dimensional Kulondola: ± 20μm
Kuthamanga Kwambiri Kwambiri: 200mm / s
Magalimoto Kamera Otsika Kutentha kuwotcherera
Kukula kwa Weld: 0.7mm
Kuzama kolowera: 0.4mm
Kuwotcherera liwiro: 10mm/s
Kutentha kwa kuwotcherera: Maonekedwe: Pamwamba Wosalala, Wopanda Oxidation, Wopanda Spatter
Kudula Kopanda Mpweya wa PCB
Kudula Liwiro kwa 2mm wandiweyani PCB: 25mm/s
Kulondola: ± 20μm
Malo Okhudzidwa ndi Kutentha: Ubwino wam'mphepete: Wopanda kaboni
PCB QR Code Laser Marking
Khodi ya QR: A-level
Laser Spot Quality: Uniform & Round
Kuzindikiritsa Kumveka: Kapangidwe Kakuthwa
Dimensional Kulondola: ± 0.05mm
MiniLED Backplane Kudula Kaboni Kwaulere
Kudula Liwiro kwa 1.6mm wandiweyani Backplane: 25mm/s
Kulondola: ± 20μm
Malo Okhudzidwa ndi Kutentha: Ubwino wam'mphepete: Wopanda kaboni
Kuyendera Zida Machining
Kuyendera kwa Hole Kwapadera
Kulolera Kwamalo: Φ0.04mm (±0.02mm)
Kulekerera kwa Angular: ± 0.1 °