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MicroEtch 80LM

Overview

The equipment utilizes a high-power pulsed laser as the processing light source. By integrating model reconstruction and a five-axis linkage system combining mechanical axes with a galvanometer, it enables precision surface etching on large rotary surfaces, three-dimensional micro-curved surfaces, and two-dimensional planes. This system offers exceptional advantages in high-efficiency, high-precision etching on three-dimensional surfaces.

    Features

    ● Gantry-style structure with a rotary table, designed for surface etching on large rotary components, while also supporting three-dimensional micro-curved surfaces and planar etching applications.

    ● Integrated mechanical and galvanometer axes with five-axis linkage, ensuring seamless, high-precision, and high-efficiency etching without stitching errors.

    ● Real-time reconstruction and processing of 3D part models, eliminating the need for pre-processing or simulation, making it adaptable for various workpieces.

    ● Advanced 3D surface interpolation and path optimization, enabling quick and efficient pre-processing of machining models.

    ● Dedicated etching software, supporting 3D rotary model image positioning, planar image measurement, hardware/process status monitoring, and access control configuration.

    Specifications

    Travel (X/Y/Z) (mm)

    800/700/350

    B Axis (°)

    n × 360

    Positioning Accuracy(X/Y/Z) (mm)

    0.005 / 0.005 / 0.01

    B Axis Accuracy (arc sec)

    15

    Rapid Traverse Speed (X/Y/Z Axis) (mm/s)

    300 / 300 / 100

    Rotation Speed (B Axis) (rpm)

    10

    Average Power (w)

    20

    Maximum Workpiece Weight (kg)

    20

    Maximum Worktable Load (kg)

    30

    Weight (kg)

    5000

    Dimensions (mm) (W × D × H)

    3700 × 4350 × 3000

    ★ Machine travel and laser configuration can be customized

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