MicroEtch 80
Features
● Supports large-format etching on complex, non-developable 3D curved surfaces.
● Integrated 3D model analysis and programming functions, enabling precise segmentation and path optimization for large-area curved surface graphics.
● Real-time 3D model processing visualization.
● Advanced vision-based alignment and high-precision automatic distance focusing for accurate processing.
● Hardware status monitoring system for detecting anomalies, featuring an intuitive HMI for simple and user-friendly operation.
● One-click processing data generation, eliminating the need for manual programming and enabling fully automated machining.
● Built-in safety interlock system, ensuring laser operation safety.
● Equipped with air-blowing and dust purification functions for a clean processing environment.
Specifications
|
Free Travel Range (X/Y/Z) (mm) |
800/500/450 |
|
Positioning Accuracy (X/Y/Z) (mm) |
0.015 |
|
Repeatability Accuracy (X/Y/Z) (mm) |
0.010 |
|
A/C Axis Travel (°) |
±110/0-360 |
|
A/C Axis Positioning Accuracy (″) |
15 |
|
A/C Axis Repeatability Accuracy (″) |
10 |
|
Pulse Width (fs) |
<290 |
|
Average Power (w) |
20 |
|
Maximum Workpiece Rotation Diameter (mm) |
Φ200 |
|
Worktable Load Capacity (kg) |
20 |
|
Maximum Curved Surface Workpiece Size (mm) |
Φ200 × 200 |
|
Maximum Planar Workpiece Size (mm) |
700 × 400 (Requires Dedicated Fixture) |
|
Scanning Width Marking Accuracy (mm) |
±0.02 |
|
Weight (t) |
~8 |
|
Dimensions (mm) (W × D ×H) |
4750 × 4200 × 2600 |
★ Machine travel and laser configuration can be customized