MicroEtch 200L
Features
● Supports large-format etching on complex, non-developable 3D curved surfaces, ensuring high precision and efficiency.
● Integrated 3D model analysis and programming capabilities, enabling precise segmentation and path optimization.
● Real-time 3D model processing visualization, allowing users to monitor the machining process.
● Advanced vision-based alignment and high-precision automatic distance focusing, ensuring accurate processing.
● Built-in anti-collision function, enhancing operation safety.
● Hardware status monitoring system for detecting anomalies, featuring an intuitive HMI for simple and user-friendly operation.
● One-click processing data generation, eliminating the need for manual programming.
● Integrated safety interlock system, ensuring laser operation safety.
Specifications
|
X/Y/Z Free Travel Range (mm) |
2000/1600/800 |
|
X/Y/Z Positioning Accuracy (mm) |
0.02 |
|
X/Y/Z Repeatability Accuracy (mm) |
0.01 |
|
A/C Axis Travel (°) |
±110/0-360 |
|
A/C Axis Positioning Accuracy (″) |
15 |
|
A/C Axis Repeatability Accuracy (″) |
10 |
|
Pulse Width (ps) |
1-5 |
|
Average Power (w) |
50 |
|
Max Workpiece Size (Cylindrical) (mm) |
φ900 × 800 |
|
Single Scan Marking Accuracy (mm) |
±0.02 |
|
Weight (t) |
~25 |
|
Dimensions (mm) (W × D ×H) |
4100 × 6200 × 4500 |
|
Worktable Size (mm) (L × W) |
2000 × 1400 |
|
Worktable Load Capacity (kg) |
3000 |
★ Machine travel and laser configuration can be customized

