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Fiber Laser Ceramic Processing Equipment MC-F350-AT.jpg

MC-F350-AT

Overview

The fiber laser ceramic processing equipment is specifically designed for cutting hard and brittle ceramic materials. It excels in processing alumina, aluminum nitride, silicon nitride, zirconia ceramics, and sapphire. Its key technological advantages include: Clean and residue-free scribing edges; High-speed drilling of micro-holes with diameters below 0.15mm; Minimal heat-affected zone (HAZ) with no thermal cracking.

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    Features

    ● Small spot size: enables high-quality, high-efficiency precision processing

    ● Minimal heat impact: reduces material selection constraints and prevents thermal damage

    ● Fully automated operation: features automatic loading and unloading, assisted by machine vision for automatic calibration and alignment

    ● DXF file import: supports DXF graphic import for layered processing of various basic shapes

    Specifications

    Platform Movement Range (mm)

    350 × 350

    Maximum Processing Size (mm)

    300 × 250

    Drilling Efficiency (/)

    ≥8 holes per second (Φ0.1mm @ T0.5mm @ S2mm)

    Scribing Speed (mm/s)

    10 - 200

    Minimum Hole Diameter (mm)

    Φ0.04

    Platform Positioning Accuracy (μm)

    ±3

    Repeat Positioning Accuracy (μm)

    ±2

    Hole Roundness (μm)

    ≤±20 (Φ0.1mm@T0.5mm)

    Minimum Cutting Line Width (μm)

    30

    Cutting Thickness (mm)

    ≤2

    Dimensions (W × D × H)

    1440 × 1400 × 2000

    Weight (kg)

    1650

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