Microhole Machining
Porous qhov nyob rau hauv coated khoom
Kev ua haujlwm siab tshaj plaws ntawm ob lub chaw nres tsheb: φ450 * 400mm
Kev ua haujlwm raug: ± 0.05mm
Qhov siab tshaj plaws qhov sib piv: 20: 1
Pem hauv ntej ntawm Porous Qhov
Kev ua haujlwm siab tshaj plaws ntawm ob lub chaw nres tsheb: φ450 * 400mm
Kev ua haujlwm raug: ± 0.05mm
Qhov siab tshaj plaws qhov sib piv: 20: 1
Hla-Section ntawm Porous Qhov hauv Coated Khoom
Kev ua haujlwm siab tshaj plaws ntawm ob lub chaw nres tsheb: φ200 * 260mm
Qhov tseeb qhov tseeb: ± 0.03mm
Qhov siab tshaj plaws qhov sib piv: 15: 1
Roughness: ≤Ra3.2
Dolphin zoo li lub qhov
Kev ua haujlwm siab tshaj plaws: φ200 * 220
Kev ua haujlwm raug: ± 0.03mm
Qhov siab tshaj plaws qhov sib piv: 15: 1
Roughness: ≤Ra3.2
Swan-shaped Qhov
Kev ua haujlwm siab tshaj plaws: φ200 * 220
Kev ua haujlwm raug: ± 0.03mm
Qhov siab tshaj plaws qhov sib piv: 15: 1
Roughness: ≤Ra3.2
Kev kub ceev Microhole Machining
High-efficiency Machining ntawm Tshwj xeeb-zoo li qhov hauv Superalloys
Max machining loj: ≤ф1000 * 600mm
Remelted txheej: ≤0.03mm
Qhov taub qhov tseeb: ≤ ± 0.02mm
Txiav ceev: ≥200mm / min
Pawg Loj Loj Qhov Machining rau qhov tshwj xeeb zoo li qhov hauv Coated Combustion Chambers
Max machining loj: ≤ф1000 * 600mm
Qhov tseeb qhov tseeb: ± 0.03mm
Recast txheej: ≤0.05mm
Ib lub qhov machining lub sij hawm: ≤15s
Group Hole Machining rau Coated Ceramic Matrix Composite Combustion Chambers
Machining qhov tseeb: ± 0.03mm
Ceramic fibers: tsis tawg, tsis muaj oxidation, tsis muaj ablation nto
Laser Etching Machining
Laser Texturing ntawm Hlau Khoom Nto
Laser ua ntawm superalloy nto, nrog siab tshaj plaws roughness mus txog Ra15 Thin-walled qhov chaw: tsis deformation, tsis muaj oxidation, tsis muaj remelted txheej
Laser Texturing ntawm Composite Materials Surfaces
Laser ua ntawm woven composite nto
Tshaj tawm cov iav fiber ntau txheej
Tsis muaj kev puas tsuaj rau iav substrate
Tsis muaj blackening lossis carbonization ntawm substrate
Txiav ntawm Hemispherical Hlau Shielding npog
Hlau thickness: 0.3mm, 0.1mm
Qhov loj me: φ300mm
Qhov siab: 180mm
Tus kheej qhov ntev: 1.18mm
Kev ua haujlwm raug: ± 0.01mm
Yam tsawg kawg nkaus ua tiav: 0.1mm
Tsis muaj burrs lossis carbonization tom qab txiav
Etching ntawm Friction Rings
Etching qhov tob: 5 ± 1μm
Kev ua haujlwm raug: ± 0.01mm
Qhov tob qhov tseeb: ± 0.005μm
Tsis muaj khawb, oxidation, burrs, los yog remelted txheej ntawm qhov chaw
Microstructure Scribing ntawm Cov Txheej Txheem Tshwj Xeeb
5-axis txuas (X, Y, Z, Gx, Gy) laser ua kab dav: ≤0.02mm
Ua qhov tob: ≤0.01mm
Kab nrug: 0.2 ± 0.005mm
Cov kab ua haujlwm tsis sib xws, tsis muaj qhov pom tseeb khoov deformation lossis blackening
Etching ntawm Resonant Microstructures (1)
Multi-txheej hlau txheej + composite substrate, substrate puas tom qab etching: ≤30μm
Kev ua haujlwm raug: ± 0.01mm
Yam tsawg kawg nkaus ua tiav: 0.1mm
Tsis muaj tev ntawm txheej tom qab etching, tsis muaj blackening lossis carbonization ntawm substrate
Etching ntawm Resonant Microstructures (2)
70μm tooj liab txheej + iav fiber ntau sib xyaw, tsis muaj residual tooj liab txheej tom qab etching, substrate puas: ≤30μm
Kev ua haujlwm raug: ± 0.01mm
Yam tsawg kawg nkaus ua tiav: 0.1mm
Tsis muaj blackening lossis carbonization ntawm substrate
Etching ntawm Resonant Microstructures (3)
3μm txhuas txheej + iav fiber ntau sib xyaw, txhuas txheej etched,
substrate puas: ≤5μm
Kev ua haujlwm raug: ± 0.01mm
Yam tsawg kawg nkaus ua tiav: 0.1mm
Tsis muaj residual aluminium hais, tsis muaj carbonization ntawm iav fibers
Etching ntawm Resonant Microstructures (4)
Kev ua haujlwm raug: ± 0.01mm
Yam tsawg kawg nkaus ua tiav: 0.1mm
Hlau txheej + sib xyaw substrate, hlau txheej ntawm etched nto, cov khoom sib xyaw tsis muaj kev puas tsuaj, tsis muaj blackening, thiab tsis muaj carbonization
Ultra-Precision Microhole Machining
Spherical Lim Mesh Drilling
Qhov Loj: 600 qhov
Qhov Loj: Ø 0.1mm
Precision: ± 0.01 hli
Drilling Direction: Ib txwm rau saum npoo
Tapered Lim Mesh Drilling (1)
Qhov Loj: 10,200 qhov
Qhov taub: Ø0.05mm
Precision: ± 0.02 hli
Tapered Lim Mesh Drilling (2)
Qhov Loj: 600 qhov
Qhov Loj: Ø 0.1mm
Precision: ± 0.01 hli
Drilling Direction: Ib txwm rau saum npoo
Laser txiav ua
Connector Tab Txiav
Lub sijhawm txiav ib zaug (0.2 hli tuab Cu / Sn-Cr plating): 0.12s Kev ua haujlwm siab ua tau raws li tus qauv tsim cov kab CT: Carbon-dawb, Burr-dawb OS yield tus nqi:> 99% SI soj ntsuam dhau: Tsis muaj qhov tsis xws luag
DPC Circuit Board txiav
Txiav ceev rau 0.5mm-thick Board: 20mm / s
Txiav ceev rau 1.0mm-thick Board: 5mm / s
Dimensional raug: ± 20μm
Ib nrab-txiav Scribing Ceev: 200mm / s
Automotive Lub Koob Yees Duab Tsawg-kub Vuam
Weld dav: 0.7mm
Qhov tob tob: 0.4mm
Vuam ceev: 10mm / s
Vuam kub: Cov tsos mob: Smooth nto, Oxidation-dawb, Spatter-dawb
PCB Carbon-dawb txiav
Txiav ceev rau 2 hli-thick PCB: 25mm / s
Qhov tseeb: ± 20μm
Thaum tshav kub kub cuam tshuam: Ntug Zoo: Tsis muaj Carbon
PCB QR Code Laser npav
QR Code Qib: A-qib
Laser Spot Quality: Uniform & Round
Marking Clarity: Ntsej Muag
Dimensional raug: ± 0.05mm
Mini LED Backplane Carbon-dawb txiav
Txiav ceev rau 1.6mm-thick Backplane: 25mm / s
Qhov tseeb: ± 20μm
Thaum tshav kub kub cuam tshuam: Ntug Zoo: Tsis muaj Carbon
Kev tshuaj xyuas cov cuab yeej Machining
Kev tshuaj xyuas tshwj xeeb-zoo li lub qhov
Txoj hauj lwm kam rau ua: Φ0.04mm (± 0.02mm)
Angular kam rau ua: ± 0.1 °