Fiber Laser Ceramic Laser Processing Equipment
Features
●Stress-free non-mechanical contact processing; supports DXF document import and can process arbitrary graphics;
●Small light spot, thin line width, high peak energy, achieving high processing efficiency with minimal heat-affected zone;
●Equipped with auxiliary machine vision and automatic calibration, featuring high-precision image recognition and positioning functions for convenient and fast operation;
●Electro-optical conversion efficiency > 30%; air-cooled compact product; fiber laser with high stability and maintenance-free operation;
●Can be flexibly matched with loading and unloading mechanisms to realize automated operations.
Application Fields
1. Drilling and cutting of LED ceramic substrate brackets;
2. Dicing of automotive & LED ceramic circuit substrates;
3. Smart terminal electronic products such as mobile phone backplanes and 3C electronics;
4. Precision contour cutting of watch gears & eyeglass frames;
5. Drilling of earpiece and sound cylinder.
Specifications
|
Parameter |
Specification |
|
Platform Movement Range |
350mm*350mm (optional) |
|
Maximum Cutting Size |
300mm*250mm (optional) |
|
Cutting Speed |
≤50mm/s |
|
Scribing Speed |
≥200mm/s |
|
Positioning Accuracy |
±3um |
|
Repeat Positioning Accuracy |
±2um |
|
Minimum Cutting Line Width |
≤20um |
|
Cutting Thickness |
≤2mm |
|
Smallest Processed Hole |
Φ0.05mm |
|
Processing Accuracy |
≤±5um |
|
Equipment Dimensions |
1400mm*1200mm*1700mm |
|
Equipment Weight |
Approximately 1500kg |