Coverlay Non-Carbonization Laser Cutting Equipment
Features
●The equipment adopts a marble anti-vibration platform with a stable and solid overall structure and an integrated enclosed structure, providing guarantees for high-speed, high-precision, and high-yield production;
●Equipped with a picosecond ultraviolet ultrafast laser, the ultrashort pulse processing has almost no heat conduction, with good beam quality and stable power;
●Integrates imported high-precision digital scanning galvanometer and high-precision linear motor platform;
●The professional cutting software can directly import DXF graphics made by CAD and cut accurately according to the input graphics, realizing what you see is what you get.
Application Fields
It can be applied to the precision cutting of various non-metallic materials such as flexible OLED screens, 5G application materials, LCP, FPC, coverlay, camera modules, silicon wafers, and MPI, as well as the etching and surface treatment of various metal materials.
Specifications
|
Parameter |
Specification |
|
Laser Power |
15W |
|
Maximum Cutting Size of Product |
550*500mm |
|
Laser Pulse Width |
<15ps |
|
Scanning Range of Galvanometer |
50mm×50mm |
|
Scanning Speed of Galvanometer |
≤8000mm/s |
|
Positioning Accuracy of Platform |
±3um |
|
Repeat Positioning Accuracy of Platform |
±1.5um |
|
Moving Speed of Platform |
≤1000mm/s |
|
CCD Positioning Accuracy |
±5um @2 million pixels |
|
Minimum Cutting Line Width |
≤25um |
|
Cutting Dimension Accuracy |
±30um |
|
Equipment Dimensions |
1500mm*1300mm*1750mm |
|
Equipment Weight |
Approximately 1600kg |