Microhole Machining
Porous Hole in Coated Material
Maximum processing size of dual-station: φ450*400mm
Processing accuracy: ±0.05mm
Maximum depth-diameter ratio: 20:1
Front Side of Porous Hole
Maximum processing size of dual-station: φ450*400mm
Processing accuracy: ±0.05mm
Maximum depth-diameter ratio: 20:1
Cross-Section of Porous Hole in Coated Material
Maximum processing size of dual-station: φ200*260mm
Hole-groove accuracy: ±0.03mm
Maximum depth-diameter ratio: 15:1
Roughness: ≤Ra3.2
Dolphin-shaped Hole
Maximum processing size: φ200*220
Processing accuracy: ±0.03mm
Maximum depth-diameter ratio: 15:1
Roughness: ≤Ra3.2
Swan-shaped Hole
Maximum processing size: φ200*220
Processing accuracy: ±0.03mm
Maximum depth-diameter ratio: 15:1
Roughness: ≤Ra3.2
High-Speed Microhole Machining
High-efficiency Machining of Special-shaped Holes in Superalloys
Maximum machining size: ≤ф1000*600mm
Remelted layer: ≤0.03mm
Hole diameter accuracy: ≤±0.02mm
Cutting speed: ≥200mm/min
Massive Group Hole Machining for Special-shaped Holes in Coated Combustion Chambers
Maximum machining size: ≤ф1000*600mm
Hole-making accuracy: ±0.03mm
Recast layer: ≤0.05mm
Single hole machining time: ≤15s
Group Hole Machining for Coated Ceramic Matrix Composite Combustion Chambers
Machining accuracy: ±0.03mm
Ceramic fibers: no fracture, no oxidation, no surface ablation
Laser Etching Machining
Laser Texturing of Metal Material Surfaces
Laser processing on superalloy surfaces, with maximum roughness up to Ra15 Thin-walled parts: no deformation, no oxidation, no remelted layer
Laser Texturing of Composite Material Surfaces
Laser processing on woven composite surfaces
Exposing the glass fiber layer
No damage to the glass substrate
No blackening or carbonization of the substrate
Cutting of Hemispherical Metal Shielding Covers
Metal thickness: 0.3mm, 0.1mm
Part size: φ300mm
Height: 180mm
Individual dimension: 1.18mm
Processing accuracy: ±0.01mm
Minimum processing size: 0.1mm
No burrs or carbonization after cutting
Etching of Friction Rings
Etching depth: 5±1μm
Processing accuracy: ±0.01mm
Depth accuracy: ±0.005μm
No scratches, oxidation, burrs, or remelted layer on the part surface
Microstructure Scribing of Special Coatings
5-axis linkage (X, Y, Z, Gx, Gy) laser processing line width: ≤0.02mm
Processing depth: ≤0.01mm
Line spacing: 0.2±0.005mm
Processed lines are uniform, with no obvious bending deformation or blackening
Etching of Resonant Microstructures(1)
Multi-layer metal coating + composite substrate, substrate damage after etching: ≤30μm
Processing accuracy: ±0.01mm
Minimum processing size: 0.1mm
No peeling of the coating after etching, no blackening or carbonization of the substrate
Etching of Resonant Microstructures(2)
70μm copper coating + glass fiber composite, no residual copper coating after etching, substrate damage: ≤30μm
Processing accuracy: ±0.01mm
Minimum processing size: 0.1mm
No blackening or carbonization of the substrate
Etching of Resonant Microstructures(3)
3μm aluminum coating + glass fiber composite, aluminum coating etched,
substrate damage: ≤5μm
Processing accuracy: ±0.01mm
Minimum processing size: 0.1mm
No residual aluminum particles, no carbonization of glass fibers
Etching of Resonant Microstructures(4)
Processing accuracy: ±0.01mm
Minimum processing size: 0.1mm
Metal coating + composite substrate, metal coating on the etched surface,composite material has no damage, no blackening, and no carbonization
Ultra-Precision Microhole Machining
Spherical Filter Mesh Drilling
Hole Quantity: 600 holes
Hole Diameter: Ø0.1mm
Precision: ±0.01mm
Drilling Direction: Normal to the surface
Tapered Filter Mesh Drilling (1)
Hole Quantity: 10,200 holes
Hole Diameter: Ø0.05mm
Precision: ±0.02mm
Tapered Filter Mesh Drilling (2)
Hole Quantity: 600 holes
Hole Diameter: Ø0.1mm
Precision: ±0.01mm
Drilling Direction: Normal to the surface
Laser Cutting Processing
Connector Tab Cutting
Single-tab cutting time (0.2mm thick Cu/Sn-Cr plating): 0.12s High efficiency meeting standard production line CT: Carbon-free, Burr-free OS yield rate: >99% SI inspection passed: No defects
DPC Circuit Board Cutting
Cutting Speed for 0.5mm-thick Board: 20mm/s
Cutting Speed for 1.0mm-thick Board: 5mm/s
Dimensional Accuracy: ±20μm
Half-cut Scribing Speed: 200mm/s
Automotive Camera Low-Temperature Welding
Weld Width: 0.7mm
Penetration Depth: 0.4mm
Welding Speed: 10mm/s
Welding Temperature: <60°C
Appearance: Smooth Surface, Oxidation-free, Spatter-free
PCB Carbon-Free Cutting
Cutting Speed for 2mm-thick PCB: 25mm/s
Accuracy: ±20μm
Heat-Affected Zone: <20μm
Edge Quality: Carbon-free
PCB QR Code Laser Marking
QR Code Grade: A-level
Laser Spot Quality: Uniform & Round
Marking Clarity: Sharp Texture
Dimensional Accuracy: ±0.05mm
MiniLED Backplane Carbon-Free Cutting
Cutting Speed for 1.6mm-thick Backplane: 25mm/s
Accuracy: ±20μm
Heat-Affected Zone: <20μm
Edge Quality: Carbon-free
Inspection Equipment Machining
Special-Shaped Hole Inspection
Positional Tolerance: Φ0.04mm (±0.02mm)
Angular Tolerance: ±0.1°